Electronics

Rayben Technologies (HK) Limited

🌍 Official Website 🏢 HKSTP Source
92 Potential

Decision Maker

N/A
enquiry.marketing@hkstp.org
+852 2629 1818
5/F, Building 5E, 5 Science Park East Avenue, Hong Kong Science Park
Raw Description
Company Background Information: | Founded in 2001, RAYBEN Group is specialized in automotive grade PCB in resolving issues of high power heat transfer, high voltage, high frequency and system mininurization in intelligent automotive lightings, power electronics and AI applications. | With headquarter in Hong Kong and production sites in Zhuahi and Jiang Xi, we also have global sales offices (US, Germany and Taiwan) and application and testing center in ShenZhen to serve customers in China, EU, USA, Japan, South Korea and SE Asian regions. | We offer full PCB solutions and production capacity from conventional HDI / HLC, Thick copper IMS boards to embedded ceramic multiple layered PCB (patent protected). | Activities in Science Park: | We provide sales and application technical support services.

Strategic Analysis

Executive Brief

Rayben Technologies is a specialist in thermal management for high-performance electronics, focusing on automotive-grade PCBs, AI applications, and power electronics. They are industry leaders in resolving heat transfer bottlenecks through Insulated Metal Substrates (IMS) and patented embedded ceramic PCB technologies. As they push toward high-frequency and miniaturized AI hardware, they face the physical limits of traditional dielectric and ceramic materials.

Strategic Fit & Lead Score

Lead Score: 92/100

  • Why this Score? Rayben's entire business model revolves around "resolving issues of high power heat transfer." While they currently utilize thick copper and embedded ceramics (thermal conductivity ~170-230 W/mK), CVD Diamond offers a 5x to 10x performance leap (>1200-2000 W/mK). Their involvement in AI and GaN-based power electronics makes them a prime candidate for transitioning from ceramic-embedded PCBs to Diamond-enhanced substrates.

6C Solutions Proposal

Application Area 6C Solution Technical Value Prop
Next-Gen AI & GPU PCBs PCD Heat Spreaders Replace AlN/Al2O3 inserts with PCD. Thermal conductivity up to 2000 W/mK allows for 40% higher power density in AI accelerators without increasing footprint.
High-Power Automotive LED Direct Diamond Coating 6C can provide MPCVD diamond coating services directly onto non-standard substrates to create a "Diamond-on-Metal" IMS, eliminating the high-thermal-resistance epoxy dielectric layer.
RF & High-Frequency (5G/6G) SCD Substrates Single Crystal Diamond provides the lowest dielectric loss tangent and highest breakdown voltage for Rayben’s high-frequency automotive radar and communication PCBs.
In-House R&D Capability Custom MPCVD Reactor Build Enable Rayben to move from a PCB assembler to a material-growth powerhouse. We provide the reactor and "Process Recipes" to grow diamond layers directly on their patented ceramic inserts.
Power Electronics (GaN/SiC) BDD Sensors Integrated Boron Doped Diamond sensors within the PCB stack for real-time, chemically inert temperature and voltage monitoring in harsh automotive environments.

Engagement Hooks

  • Technical Question for CTO: "Your patented embedded ceramic solution is excellent for current GaN applications, but as you move toward AI-driven power densities exceeding 500W/cm2, how are you addressing the interfacial thermal resistance (ITR) between the ceramic insert and the copper trace? Would a direct-grown MPCVD diamond interface solve your current throttling issues?"

  • Value Statement: "6C can upgrade Rayben’s thermal management portfolio from 'Ceramic-grade' to 'Quantum-grade' by integrating CVD diamond, effectively doubling your power density limits for AI and automotive lighting applications."

Technical Specifications Table (6C Material Advantage)

Property Alumina (Al2O3) Aluminum Nitride (AlN) 6C PCD Diamond 6C SCD Diamond
Thermal Cond. (W/mK) 30 170 - 230 1200 - 1800 >2000
Thermal Expansion (ppm/K) 8.1 4.5 1.0 - 1.5 1.0
Dielectric Constant 9.8 8.5 5.7 5.7
Surface Roughness (Ra) < 500nm < 100nm < 10nm < 1nm
Bandgap (eV) 8.0 6.2 5.5 5.5