Electronics

OptiHK Limited

🌍 Official Website 🏢 HKSTP Source
92 Potential

Decision Maker

N/A
enquiry.marketing@hkstp.org
+852 2629 1818
5/F, Building 5E, 5 Science Park East Avenue, Hong Kong Science Park
Raw Description
Established as a spin-off from The Chinese University of Hong Kong, leveraging 25 years of R&D at CUHK, the company is currently in start-up mode with a core team of founders comprising six PhDs. | Description | OptiHK Ltd is a fabless design house for silicon photonic integrated circuits, established as a spin-off from The Chinese University of Hong Kong, leveraging 25 years of R&D at CUHK. | Our vision is to establish silicon photonics as a mainstream technology that becomes as ubiquitous in society in the 21st century as microelectronics and electronic integrated circuits were in the 20th century | The company's mission is to create silicon photonics system-on-chip products and modules which will empower companies to develop advanced, high-performance and compact systems, improving performance beyond what can be achieved with conventional microelectronics or bulk optical systems. || Product | High-Capacity Si Photonic modules for data centre transceiver market | Silicon photonics system-on-chip for optical coherence tomography | Co-Packaged Optics (CPO) for AI chips | Industrial metrology using on-chip spectrometers | Technology | OptiHK focuses on its core competency in advanced silicon photonics chip design. We can collaborate with you to understand your design requirements and provide you with custom-designed Si photonic chips to help you develop your next-generation products. We can offer design services or ship 3.2T silicon photonic engines for co-packaged optics (CPO) and data centre transceiver products, and high-resolution broadband integrated optical spectrometers for optical coherence tomography and optical spectroscopy applications.

Strategic Analysis

Executive Brief

OptiHK Limited is a high-growth silicon photonics fabless design house specializing in high-bandwidth interconnects (3.2T engines) and Co-Packaged Optics (CPO) for the AI and data center markets. Their core challenge involves managing extreme power densities and maintaining signal integrity in increasingly compact, high-performance "system-on-chip" photonic modules and spectrometers.

Strategic Fit & Lead Score

Lead Score: 92/100

Why this Score? OptiHK's primary product, Co-Packaged Optics (CPO) for AI chips, represents the most significant thermal bottleneck in modern computing. As they push toward 3.2T data rates, the heat generated by the electronic-photonic interface exceeds the cooling capacity of traditional copper or silicon substrates. 6C’s Diamond Technology is the industry-standard "ultimate heat sink" to enable the power densities OptiHK is targeting. Furthermore, their work in OCT and metrology could benefit from diamond’s unmatched optical transparency and refractive index.

6C Solutions Proposal

Application Area 6C Solution Technical Value Prop
CPO Thermal Management PCD Heat Spreaders (Thermal Grade) Diamond's thermal conductivity (>2000 W/mK) is 5x that of copper. Placing 6C PCD under the 3.2T engine eliminates thermal throttling in AI clusters.
Direct Si-Photonics Integration Diamond-on-Silicon CVD Coating We can deposit thin-film diamond directly onto Si wafers or passive components to provide localized cooling for high-power laser sources (DFB/Comb lasers).
Optical Metrology & OCT SCD/PCD Optical Windows For their on-chip spectrometers and OCT systems, diamond offers a wide transparency window (UV to Far-IR) and high chemical inertness for bio-sensing.
Active Device Cooling SCD (Single Crystal) Substrates For high-performance R&D, replacing silicon-on-insulator (SOI) with silicon-on-diamond (SOD) can reduce junction temperatures by >30°C.
In-house Prototyping Custom MPCVD Reactor Build Enable OptiHK or their CUHK research partners to develop proprietary Diamond-Silicon hybrid processes using a turnkey 6C reactor system.

Engagement Hooks

  • Technical Question: "As OptiHK scales to 3.2T silicon photonic engines, how are you addressing the 'thermal wall' associated with the dense integration of PICs and ASICs in Co-Packaged Optics, and have you benchmarked the Tjunction reduction afforded by synthetic diamond heat spreaders?"
  • Value Statement: "6C can help OptiHK bypass the thermal limitations of traditional silicon packaging by integrating PCD heat spreaders that offer thermal conductivity up to 2200 W/mK, ensuring your 3.2T modules maintain peak performance without throttling."