Electronics

nvidia Singapore Pte Ltd

🌍 Official Website 🏢 HKSTP Source
95 Potential

Decision Maker

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enquiry.marketing@hkstp.org
+852 2629 1818
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Raw Description
NVIDIA’s invention of the GPU sparked the PC gaming market. The company’s pioneering work in accelerated computing—a supercharged form of computing at the intersection of computer graphics, high performance computing and AI—is reshaping trillion-dollar industries, such as transportation, healthcare and manufacturing, and fueling the growth of many others.

Strategic Analysis

Executive Brief

NVIDIA is the global titan of accelerated computing, dominating the AI, High-Performance Computing (HPC), and gaming markets. Their business model revolves around designing complex GPU architectures (e.g., Hopper, Blackwell) that push the physical limits of power density and thermal management. As they move toward multi-die chips and 1000W+ TDP (Thermal Design Power) requirements, diamond integration becomes a critical necessity rather than a luxury.

Strategic Fit & Lead Score

Lead Score: 95/100

  • Why this Score? NVIDIA is currently facing "The Thermal Wall." Traditional copper or silicon-based cooling cannot keep up with the heat flux of next-gen AI accelerators. 6C’s ability to provide high-conductivity PCD wafers and direct-growth MPCVD solutions maps directly to NVIDIA's roadmap for Blackwell and future "Rubin" architectures. Furthermore, NVIDIA’s expansion into Quantum Simulation (cuQuantum) creates a long-term synergy for 6C’s SCD quantum-grade materials.

6C Solutions Proposal

Application Area 6C Solution Technical Value Prop
Thermal Management PCD Heat Spreaders Thermal conductivity >2000 W/mK (5x Copper). Eliminates local hotspots in H100/B200 GPU dies, allowing for higher clock speeds without throttling.
Advanced Packaging Diamond-on-Wafer (Direct Growth) 6C can grow PCD directly on silicon/dielectric substrates. This minimizes Interfacial Thermal Resistance (ITR), crucial for CoWoS (Chip on Wafer on Substrate) architectures.
Quantum Computing Ultra-Pure SCD (NV-Center) Provides the physical substrate for NVIDIA's quantum research. High-mobility SCD with controlled isotopic purity for qubit stability.
RF & 5G/6G Systems Diamond-on-GaN For NVIDIA's automotive (DRIVE) and networking (Mellanox) arms. Diamond substrates allow GaN transistors to operate at 3x power density.
In-House R&D Custom MPCVD Reactors Enables NVIDIA Research to prototype "Diamond-Semiconductor" hybrid chips in-house. 6C provides the reactor and the proprietary "Process Recipes."

Technical Opportunities & Logic

  • The Power Density Crisis: NVIDIA’s newest chips are reaching power densities that exceed the capacity of even advanced liquid cooling. By integrating a 6C PCD (Polycrystalline) layer, the lateral heat spreading is maximized, reducing the Junction Temperature (Tj) by up to 20°C.
  • Coefficient of Thermal Expansion (CTE) Matching: 6C can engineer diamond composite layers that better match the CTE of silicon/gallium nitride, reducing mechanical stress and increasing the lifespan of NVIDIA’s enterprise-grade hardware.
  • Surface Preparation: With Ra < 1nm on our Single Crystal Diamond, 6C offers the surface finish required for direct bonding to NVIDIA’s high-speed logic dies without introducing signal interference.

Engagement Hooks

  • Technical Question: "As NVIDIA moves toward 1000W+ TDP in the Blackwell and Rubin architectures, how is the team addressing the Interfacial Thermal Resistance (ITR) that currently limits conventional vapor chamber effectiveness? Would a direct-grown diamond buffer layer solve the bottleneck in your CoWoS-L packaging?"
  • Value Statement: "6C provides the thermal 'escape route' for NVIDIA’s next generation of AI silicon, offering MPCVD diamond solutions that deliver 5x the thermal performance of copper at a fraction of the weight and thickness."