Electronics

AMASIC Design Company Limited

🌍 Official Website 🏢 HKSTP Source
68 Potential

Decision Maker

N/A
enquiry.marketing@hkstp.org
+852 2629 1818
5/F, Building 5E, 5 Science Park East Avenue, Hong Kong Science Park
Raw Description
Product | Designing chips for the applications of power management and low frequency signal processing. Comprehensive analog circuit IPs library facilitates custom integrated circuits design. Covers fabrication technologies from BJT, CMOS, BiCMOS to BCD. We also provide services on manufacturing support, such as wafer probe-testing, Silicon foundry coordination, IC packaging and final test to customers. || A professional IC design house very experienced in Analog Integrated Circuits. Both design-according-to-specification or turn-key chip development services are available. High first Silicon successful rate with the help of our complete design IP library.

Strategic Analysis

Executive Brief

AMASIC Design Company Limited is a specialized Analog IC design house focusing on Power Management ICs (PMICs) and low-frequency signal processing. Utilizing fabrication processes like BiCMOS and BCD (Bipolar-CMOS-DMOS), they provide turn-key solutions from IP design to packaging and testing. Their expertise lies in managing high-voltage and high-current analog signals within integrated circuits.

Strategic Fit & Lead Score

Lead Score: 68/100

  • 60-79: Adjacent Tech (High Power Electronics) -> Strong potential for thermal management partnerships.

Why this Score? AMASIC operates in the Power Management and BCD (Bipolar-CMOS-DMOS) space. As power densities increase in PMICs, thermal throttling becomes the primary limit to performance. While they are a design house, their involvement in "foundry coordination" and "IC packaging" makes them a prime candidate for adopting Diamond-based thermal spreaders to differentiate their high-end Analog IPs.

6C Solutions Proposal

Application Area 6C Solution Technical Value Prop
Power Density Management PCD Heat Spreaders Integrating Poly Crystalline Diamond (PCD) into the packaging of AMASIC’s high-current BCD chips. Diamond's thermal conductivity (>1800 W/mK) is 4-5x higher than Copper, eliminating hot spots.
Advanced Packaging Services Diamond-on-Wafer Coating 6C can provide direct MPCVD diamond growth on the backside of AMASIC’s processed wafers (post-grinding) to create a superior thermal path for power-dense analog IPs.
Harsh Environment Analog SCD/PCD Dielectrics For AMASIC's custom ICs in aerospace or industrial sensing, diamond provides extreme radiation hardness and wide-bandgap stability (5.5 eV) far exceeding standard Silicon.
Wafer-Level Testing Custom BDD Electrodes Using Boron Doped Diamond (BDD) coatings for high-durability probe-test pins, reducing wear during high-volume wafer-level testing of BCD/CMOS chips.

Engagement Hooks

  • Technical Question: "As your BCD-based power management designs move toward higher power densities, at what threshold (W/mm2) does traditional lead-frame or ceramic packaging become the primary bottleneck for your reliability and MTBF (Mean Time Between Failure) ratings?"
  • Value Statement: "6C enables AMASIC to break the 'Thermal Wall' in analog design by integrating MPCVD diamond heat spreaders that offer passive cooling performance unreachable by traditional copper or alumina solutions."