Electronics

JSAB Technologies Limited

šŸŒ Official Website šŸ¢ HKSTP Source
88 Potential

Decision Maker

Ms. Debbie Cheng
debbiecheng@jsab.com.hk
+852 3611 7567
Units 912-913, 9/F, Building 16W, 16 Science Park West Avenue, Hong Kong Science Park, New Territories
Raw Description
JSAB Technologies Limited designs and sells power semiconductor devices. Our products are manufactured at top semiconductor foundries and packaging factories to ensure quality and delivery. Our power devices can be applied for new automotive, new energy, industrial applications, motor control, high power equipment, electric railways, power transmission, fu inverter (wind generator systems), supercomputers, cloud servers, power supplies, medical equipment, automobiles EV DC/DC OR DC/AC inverters, motor controllers, robots, uninterrupted power supply (ups), consumer appliances, aircon inverters, washing machines and refrigerators. Led by Prof Sin Kin On, Johnny, an IEEE Fellow, our core team members are PhD graduates and experienced managers. | Description | Design and sales of power semiconductor devices; self-owned patented technology platforms and products include IGBT, SGT and SJ || Product | A new High-tech company in Hong Kong specializing in the design, R&D and sales of power semiconductor modules with core technologies driven by local power device design and material support.

Strategic Analysis

Executive Brief

JSAB Technologies is a high-performance power semiconductor design house specializing in Insulated Gate Bipolar Transistors (IGBT), Shield Gate Trench (SGT) MOSFETs, and Super Junction (SJ) MOSFETs. Led by world-class academic expertise (IEEE Fellow Prof. Johnny Sin), they target the "heavy lifters" of the electronics world: EV inverters, wind turbines, and cloud server power supplies. Their technical bottleneck is the thermal-limit of Silicon, where power density is constrained by the heat dissipation capacity of the package.

Strategic Fit & Lead Score

Lead Score: 88/100

  • Direct Thermal Synergy: Their core products (IGBT/SJ) are high-heat-flux devices. As they push for higher power density in EV and Server markets, traditional cooling reaches its physical limit.
  • Material Innovation Focus: JSAB explicitly mentions "core technologies driven by local... material support," indicating a willingness to adopt advanced materials to gain a competitive edge over commodity Si suppliers.
  • Future-Proofing: While currently focused on Si-based power, their R&D trajectory likely leads to Wide Bandgap (WBG) integration, where Diamond is the ultimate substrate.

Why this Score? JSAB operates in the "Thermal Death Zone" of power electronics. Their SJ and SGT MOSFETs for cloud servers and EV DC/DC converters require aggressive heat extraction to maintain efficiency and reliability. 6Cā€™s PCD heat spreaders and custom coating services provide the exact "Material Support" their mission statement highlights.

6C Solutions Proposal

Application Area 6C Solution Technical Value Prop
EV / Industrial IGBTs PCD Heat Spreaders Replace AlN or Al2O3 ceramics with Polycrystalline Diamond (PCD). Diamond's thermal conductivity (>1800 W/mK) is 5x-10x higher than traditional ceramics, lowering junction temperatures by up to 30%.
Cloud Server Power (SJ) Direct Diamond Coating Apply MPCVD Diamond coating directly to the copper lead-frames or ceramic carriers of Super Junction MOSFETs to eliminate "hot spots" in high-frequency switching.
Next-Gen R&D (GaN/SiC) Custom MPCVD Reactor As JSAB expands into Wide Bandgap materials, a 6C MPCVD system allows them to develop proprietary GaN-on-Diamond or Diamond-on-Si recipes in-house.
High-Precision Sensing BDD Electrodes For industrial/medical applications, Boron Doped Diamond (BDD) sensors provide JSAB with a pathway to offer "Smart Power" modules with integrated electrochemical sensing.
Advanced Packaging Consulting / Process Dev 6C can optimize the interface between JSAB's Si-chips and diamond spreaders to minimize Thermal Interface Resistance (TIR).

Engagement Hooks

  • Technical Question: "Prof. Sin, as JSAB pushes the boundaries of Super Junction (SJ) MOSFETs for 800V EV architectures, how are you addressing the 'thermal wall' encountered when increasing power density beyond 50W/cm2?"
  • Value Statement: "6C can help JSAB Technologies bypass the thermal limitations of traditional Silicon packaging by integrating MPCVD Diamond heat spreaders, potentially doubling the power-handling capability of your existing IGBT and SGT platforms."