Material And Precision Engineering

AIR & LIQUID COOLING TECHNOLOGY LIMITED

🌍 Official Website 🏢 HKSTP Source
? Potential

Decision Maker

Mr. Junyuan Duan
junyuan.duan@alcdctech.com
+852 68880571
Unit 731, 7/F, Building 19W, 19 Science Park West Avenue, Hong Kong Science Park, Pak Shek Kok, N.T.
Raw Description
Our Beliefs | Liquid Cooling Isn't Optional, It's Essential for High-Density Compute | *——Air cooling hits physical limits; liquid is the only path beyond 100kW/rack* | Modularity Defines the Future, On-Demand Deployment Enables True Agility | *——No over-engineering – ALC RDHx cuts retrofit time by 60%* | Energy Efficiency Is Competitiveness, PUE<1.1 Is the Baseline | ——Liquid cooling must deliver hard savings: power, water, and space | Customer Pain Points Drive Innovation | ——From legacy retrofits to AI clusters, solutions target real operational gaps | Silent Reliability Over Loud Promises | ——Zero-leak assurance + AI-driven alerts inject certainty into critical infrastructure | Product | Data Centre Modular Rear Door Heat Exchangers：high performance air-cooling equipment installed at each rack with cold water as coolant | Liquid-to-Air CDU & Heat Exchangers：help exsiting air-cooling data center upgrade to liquid cooling with air-cooling as the cooling resource | Liquid-to-Liquid CDU: very high density liquid cooling key equipment for in-row or in room liquid cooling systems | Liquid-to-Liquid CDU： | Technology | 1. Data Centre High Performance Air Cooling Upgrade to 40kW Air-Cooling Per Rack using ALC Modular RDHx Products; | 2. Data Centre retrofit from air-cooling to liquid-cooling using ALC L2A solutions and products | 3. Data Centre sysmetic liquid cooling with high capacity CDU, secondary fluid pipe networks and manifolds/QDs | Follow Us || Founder and Executive | Mr. Junyuan Duan | (FT, HK, 90.09% Share) | Co-Founder | Mr. Xin Hu | (FT, HK,9.91% Share) | R&D Team (Mr. Xin HU) | Production & Manufacture Team Vacancy | Sales & Marketing Team Vacancy | Financial and Admin Team Vacancy | Description | ALC focuses on the cooling upgrade and liquid cooling retrofit of data centres, laying a solid foundation for AIGC infrastructure | ALC provides technical support and solutions, integrates and delivers hardware and software, as well as operation and maintenance, to create a one-stop service capability

Strategic Analysis

Executive Brief

AIR & LIQUID COOLING TECHNOLOGY LIMITED (ALC) is a specialized thermal management firm focused on the "Post-Air Cooling" era of data centers. They provide modular Rear Door Heat Exchangers (RDHx) and Cooling Distribution Units (CDU) specifically designed for high-density AIGC (AI-Generated Content) infrastructure, where power densities exceed 100kW per rack. Their value proposition centers on PUE efficiency (<1.1) and modular retrofitting of legacy air-cooled facilities into high-performance liquid-cooled environments.

Strategic Fit & Lead Score

Lead Score: 78/100 (Strong Strategic Partner / Component Supplier)

Why this Score? ALC is solving the "macro" thermal problem (moving heat from the rack to the facility). However, as they target 100kW+ per rack for AI clusters, the "micro" thermal problem—the Thermal Resistance Bottleneck at the chip-to-liquid interface—becomes the limiting factor. 6C’s Polycrystalline Diamond (PCD) is the ultimate physical solution to this bottleneck. While ALC focuses on the plumbing and heat exchange systems, 6C provides the material science to ensure that the heat actually reaches their liquid loops efficiently enough to maintain the PUE targets they promise.

6C Solutions Proposal

Application Area 6C Solution Technical Value Prop
Chip-Level Heat Spreading PCD Wafer Inserts (Up to 5") Integration of Diamond heat spreaders between the GPU/ASIC and ALC’s cold plates. Diamond’s thermal conductivity (>2000 W/mK) is 5x that of copper, eliminating "hot spots" that cause thermal throttling in AI clusters.
Cold Plate Enhancement Direct Diamond Coating Using MPCVD to deposit a thin diamond layer directly onto ALC's micro-channel cold plates. This increases surface area for heat transfer and provides a chemically inert barrier against coolant corrosion/erosion.
Water Quality Monitoring BDD Electrochemical Sensors ALC’s "Zero-Leak" and reliability promise requires pristine coolant. Boron-Doped Diamond (BDD) sensors can detect trace impurities or pH shifts in the secondary cooling loop with higher sensitivity and longevity than standard probes.
High-Power RF / Power Ops SCD Substrates For the power conversion modules within ALC’s CDUs. Replacing SiC with Diamond-based power electronics reduces heat generation at the source, further lowering the cooling load.
Next-Gen R&D Custom MPCVD System As ALC scales, they may wish to develop proprietary "Diamond-Liquid" hybrid cold plates. 6C can provide a turnkey MPCVD reactor for their R&D team to prototype advanced thermal composites.

Engagement Hooks

  • Technical Question for Mr. Xin Hu (R&D): "As ALC pushes rack densities beyond 100kW for AIGC clusters, at what point does the thermal interface resistance (TIM) and the heat spreader's lateral conductivity become the primary bottleneck for your RDHx systems, and have you benchmarked PCD (Polycrystalline Diamond) to reduce junction temperatures?"
  • Value Statement: "6C can help ALC bridge the 'Thermal Gap' between high-wattage AI silicon and your liquid cooling loops. By integrating 6C’s CVD Diamond components, ALC can deliver the world’s first 'Diamond-Ready' cooling architecture, ensuring PUE < 1.1 even at peak compute loads where copper and aluminum reach their physical limits."