Innohk

AI Chip Center for Emerging Smart Systems Limited

🌍 Official Website 🏢 HKSTP Source
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Decision Maker

Ms. Linda Fok
access_admin@inno-access.hk
+852 2356 3189
N/A
Raw Description
Established in 2020 under InnoHK, a major initiative of the Hong Kong Special Administrative Region Government to develop Hong Kong as a hub for global research, the AI Chip Center for Emerging Smart Systems (ACCESS) is wholly owned by The Hong Kong University of Science and Technology (HKUST), and in collaboration on research with The Chinese University of Hong Kong (CUHK), Stanford University (Stanford) and The University of Hong Kong (HKU). It is a tightly coordinated and multi-disciplinary center for advancing IC design and design automation technologies to enable novel data-centric computing paradigms supporting a wide range of AI applications.

Strategic Analysis

Executive Brief

ACCESS (AI Chip Center for Emerging Smart Systems) is a world-class R&D hub focused on the next generation of AI hardware architecture and Integrated Circuit (IC) design. Operating under the InnoHK initiative and led by HKUST in collaboration with Stanford, they are tackling the "Memory Wall" and "Power Wall" of modern computing. Their work involves high-density AI accelerators, heterogeneous integration, and advanced packaging—all of which are currently hitting the physical limits of traditional silicon-based thermal management.

Strategic Fit & Lead Score

Lead Score: 92/100

Why this Score? As AI chip architectures move toward 3D stacking (3D IC) and high-density compute, thermal dissipation becomes the primary bottleneck for performance. ACCESS is developing the future of AI silicon; 6C provides the ultimate material (Diamond) to enable that future. Furthermore, as an InnoHK center, they have the mandate and budget to invest in "Deep Tech" infrastructure, making them an ideal candidate for both high-performance components and custom MPCVD system sales to build their own local fabrication capabilities.

6C Solutions Proposal

Application Area 6C Solution Technical Value Prop
Advanced Packaging PCD Heat Spreaders Diamond’s thermal conductivity (>2000 W/mK) is 5x that of copper. Essential for cooling high-TDP AI accelerators and preventing thermal throttling in dense 3D-IC layouts.
Heterogeneous Integration Diamond-on-Wafer Coating Direct MPCVD growth of diamond onto silicon or GaN wafers. This eliminates interfacial thermal resistance, allowing for "near-junction" cooling of high-frequency AI processing units.
Next-Gen Substrates Electronic Grade SCD Ultra-pure Single Crystal Diamond for research into diamond-based logic or power devices that can operate at higher voltages and temperatures than traditional silicon.
In-house R&D Capability Custom MPCVD Reactor Providing ACCESS with a 6C-designed reactor allows their researchers to develop proprietary "Diamond-CMOS" recipes in-house, accelerating their IP portfolio.
Purity Control 9N Hydrogen Generators High-performance CVD growth requires ultra-pure gas. 6C’s hydrogen solutions ensure their cleanroom processes meet international standards for semiconductor-grade diamond.

Engagement Hooks

  • Technical Question: "As ACCESS pushes the boundaries of 3D-IC and heterogeneous integration for AI accelerators, how are you addressing the exponential increase in heat flux density that traditional liquid cooling and copper heat sinks can no longer manage?"
  • Value Statement: "6C enables ACCESS to shatter the thermal ceiling of AI chip design by integrating CVD diamond—the world’s best thermal conductor—directly into your hardware architecture, ensuring peak performance without thermal degradation."