Electronics

Dragonchip Limited

🌍 Official Website 🏢 HKSTP Source
68 Potential

Decision Maker

N/A
enquiry.marketing@hkstp.org
+852 2629 1818
5/F, Building 5E, 5 Science Park East Avenue, Hong Kong Science Park
Raw Description
Company Background Information: | A local fabless semiconductors company engaged in design, development, and marketing of semiconductor products worldwide under its own brand name. | Nature of Business: | Dragonchip , once a rapidly expanding incubatee. joined our Incu-Tech Programme on 19 Oct 2001. It has been a HK Science Park tenant since May 2003. | The Company focuses on the design & development of Integrated Circuits (ICs). Its technology niche lies in the low-voltage and low-power-consumption features, key enablers for handheld devices. It engages in the building of semiconductor solutions based on 0.25 micron (or below) processes, encompassing MCU core, embedded Flash Memory, RF, mixed signal, and the integration of functional blocks on single silicon chip (SoC). | Activities in Science Park : | To support Global remote control OEMs with volume shipment of embedded Flash MCU. | To support USB eCert / secure control MCU for the two Hong Kong certificate authorities (online transaction authentication). | To perform research and development on motor control ICs for DC fan-motor products. | To support RF solution for Home / Office / Building wireless access.

Strategic Analysis

Executive Brief

Dragonchip Limited is a fabless semiconductor firm specializing in the design of ultra-low-power Integrated Circuits (ICs), System-on-Chip (SoC) solutions, and embedded Flash MCUs. Their technical niche focuses on handheld devices, RF wireless access, and secure authentication hardware (USB eCert), primarily utilizing 0.25μm processes and below.

Strategic Fit & Lead Score

Lead Score: 68/100

Why this Score? While Dragonchip focuses on "low-power" applications, their high level of integration (SoC) and RF involvement creates significant thermal and performance bottlenecks. As they scale below 0.25μm, silicon's native thermal limits begin to throttle performance. 6C's diamond technology offers a path for Dragonchip to differentiate their RF and Secure MCU products through superior thermal dissipation and potential quantum-grade security features.

6C Solutions Proposal

Application Area 6C Solution Technical Value Prop
RF & Wireless SoC PCD Thermal Spreaders Diamond's thermal conductivity (>2000 W/mK) outperforms copper by 5x. Integrating PCD spreaders in RF front-ends reduces junction temperatures, increasing signal range and device lifespan.
Secure Control / eCert SCD with NV Centers For high-security "USB eCert" applications, 6C's Single Crystal Diamond (SCD) can be used for quantum-based random number generation (QRNG) or hardware-level encryption that is physically unclonable.
Handheld SoC Packaging Direct Diamond Coating 6C can provide custom MPCVD coating on carrier substrates to eliminate "hotspots" in multi-functional SoCs, enabling higher clock speeds without increasing the device footprint.
Motor Control ICs BDD Sensors In DC fan-motor R&D, Boron Doped Diamond (BDD) electrodes can be used for high-precision current sensing and feedback in harsh or high-temperature environments where silicon sensors drift.
Foundry Enhancement Process Consulting 6C can consult on integrating Diamond-on-Silicon processes for Dragonchip's next-gen 0.18μm or 90nm nodes to solve the "Thermal Wall" inherent in dense Flash integration.

Engagement Hooks

  • Technical Question: "As Dragonchip pushes for higher integration in your 0.25μm SoC designs, how are you managing the localized thermal density of the embedded Flash and RF blocks to prevent frequency throttling in handheld enclosures?"
  • Value Statement: "6C can help Dragonchip transition from 'low-power' to 'high-performance low-power' by using MPCVD diamond to dissipate heat 5x faster than traditional materials, ensuring your secure MCUs and RF chips stay cool and reliable in the smallest form factors."