Electronics

DOCTECH HK LIMITED

🚫 No Website Found 🏢 HKSTP Source
82 Potential

Decision Maker

Dr. Yu Ting Huang
vivian.huang@doctech-group.com
53482774
N/A
Raw Description
Product | Doctech has invented a novel method to fabricate nano-twin copper (nt-Cu) and nano-grain (nc-Cu) copper electroplating materials. In electroplating, controlling the additive formula and content to obtain a suitable grain structure is the key for RDLs/TSV/Interconnect/Pillars technologies, which are ideally suited for high-density requirements. Different layouts are enabled for fan-out wafer level packages to meet next-generation line/space requirements down to 2 µm. The nt-Cu and nc-Cu chemistries are formulated to enhance the reliability of fine-line RDL and improve via-filling performance. The technology requires the Cu to have optimum uniformity, high purity and reliability, superior via-filling and reduced manufacturing costs. A hybrid structure is constructed for future hybrid bonding. The two kinds of copper materials, nt-Cu and nc-Cu, can achieve direct hybrid copper-copper bonding technology at low-temperature, to promote bonding to form a stable and void-free interface and to solve the key issues in M3DIC packing for electromigration (EM) and thermomigration (TM). || Doctech HK Limited is a semiconductor company adopting a newly developed nano-twin copper material especially for the applications of three-dimensional integrated circuit (3DIC) packing. Doctech focuses on the development and commercialisation of nt-Cu as a promising nanomaterial in redistribution layers (RDLs), Cu interconnects and micro-pillar for consumer electronics. Our goal is to innovate scalable and novel nt-Cu for constructing key devices with the features of low-power consumption and transferability and to provide solutions and platform technologies. The nt-Cu material features a promising Cu-Cu bonding technology, which can provide a lower interfacial resistance, making it an ideal technology for the future hybrid Cu-Cu bonding of monolithic three-dimensional (M3D) ICs packing. | Description | A semiconductor material supplier developing a new metallisation process especially for future needs of the packaging industry

Strategic Analysis

Executive Brief

DOCTECH HK LIMITED is a specialized semiconductor materials firm focusing on advanced metallization for 3DIC and M3DIC packaging. Their core innovation involves nano-twin copper (nt-Cu) and nano-grain copper (nc-Cu) electroplating chemistries designed to enable low-temperature hybrid Cu-Cu bonding, high-density redistribution layers (RDLs), and Through-Silicon Vias (TSVs). Their technology specifically addresses the critical failures in high-density packaging: electromigration (EM) and thermomigration (TM).

Strategic Fit & Lead Score

Lead Score: 82/100 (Adjacent Tech - High Power Electronics & Advanced Packaging)

Why this Score? Doctech is solving the "interconnect bottleneck" in 3D stacked chips. While they have mastered the metal (nt-Cu) to reduce interfacial resistance, the primary driver of failure in their target environment is heat. As they push toward 2 µm line/space requirements, the current density increases exponentially. 6C’s CVD diamond offers the world’s highest thermal conductivity to complement Doctech’s nt-Cu, preventing the thermomigration (TM) issues they are currently mitigating through metallurgy alone.

6C Solutions Proposal

Application Area 6C Solution Technical Value Prop
Thermal Mitigation for M3DIC PCD Thermal Spreaders Diamond's thermal conductivity (>2000 W/mK) is 5x higher than Cu. Integrating PCD at the base of 3DIC stacks stops the heat accumulation that triggers Thermomigration (TM) in nt-Cu.
Hybrid Bonding Reliability SCD/PCD Substrates Providing ultra-flat (Ra < 1nm) diamond substrates for hybrid bonding research. Diamond's low CTE (Coefficient of Thermal Expansion) matches Silicon better than metals, reducing stress during low-temp bonding.
Electroplating Chemistry Control BDD Electrodes Doctech’s process relies on precise additive formulas. Boron-Doped Diamond (BDD) electrodes offer a wide electrochemical window for real-time sensing of organic additives in their plating baths.
System Integration Custom MPCVD Reactor Enables Doctech to develop "Diamond-Copper" composite materials or direct diamond capping on RDLs to create the ultimate high-reliability interconnect.
Fine-Line RDL Protection Diamond-Like Coatings Custom MPCVD recipes to provide atomic-level passivation on 2 µm Cu lines to prevent oxidation and enhance mechanical stiffness of the redistribution layer.

Engagement Hooks

  • Technical Question: "As you scale to 2 µm line/space and tackle Thermomigration (TM) in M3DIC stacks, have you reached the 'Thermal Ceiling' where nt-Cu's conductivity is no longer enough to dissipate Z-axis heat flux? Could a CVD Diamond heat-extraction layer enable higher current densities in your nc-Cu interconnects?"
  • Value Statement: "While Doctech optimizes the electrical path with nano-twin copper, 6C Diamond technology optimizes the thermal path, ensuring your 3DIC architectures remain stable under the extreme power densities of next-gen consumer electronics."