Executive Brief
Diodes Hong Kong Limited (DHK), a subsidiary of Diodes Incorporated, is a global leader in high-speed, high-voltage semiconductor solutions. Their portfolio spans discrete, logic, and analog components, with a heavy focus on connectivity (PCIe, USB, HDMI), power management (MOSFETs, DC-DC converters), and automotive-grade sensors. As they push toward higher power densities and faster switching frequencies, thermal dissipation becomes their primary engineering bottleneck.
Strategic Fit & Lead Score
Lead Score: 78 (Adjacent Tech / High-Power Electronics)
Why this Score? DHK is a high-volume manufacturer of power MOSFETs and high-speed redrivers. These components are hitting "thermal walls" where traditional silicon or copper-based heat management limits performance. 6C’s PCD (Polycrystalline Diamond) heat spreaders and custom MPCVD coating services offer a direct path to doubling power density in their automotive and industrial product lines. Furthermore, their interest in high-voltage muxes aligns with Diamond’s superior dielectric breakdown strength.
6C Solutions Proposal
| Application Area | 6C Solution | Technical Value Prop |
|---|---|---|
| Power MOSFETs & Rectifiers | PCD Heat Spreaders (Large Wafer) | Thermal conductivity > 1800 W/mK. Replaces AlN or Al2O3 to reduce junction temperatures by 30-50 °C, extending component lifespan in automotive PDUs. |
| High-Speed Redrivers (PCIe/USB) | Custom Diamond Passivation | Ultra-low dielectric constant and high thermal conductivity allow for tighter component spacing in high-speed signal chains without thermal crosstalk. |
| Industrial/Auto Sensors | BDD (Boron Doped) & SCD Sensors | Diamond-based Hall-effect or temperature sensors provide radiation hardness and chemical inertness for harsh industrial/engine-block environments. |
| R&D / New Product Intro | Custom MPCVD System Build | Provide DHK’s R&D center with a proprietary 6C reactor to develop "GaN-on-Diamond" or "Diamond-on-Silicon" IP in-house. |
| Packaging & Tooling | PCD Micro-tooling Coatings | Direct diamond coating on precision molds for high-volume semiconductor packaging, reducing wear and downtime. |
Engagement Hooks
- Technical Question: "As Diodes moves toward PCIe 5.0/6.0 and higher power density MOSFETs, how are you addressing the 'thermal throttling' that occurs at the package level when traditional heat sinks can no longer keep up with the >200W/cm2 heat flux?"
- Value Statement: "6C can help Diodes Hong Kong surpass the physical limits of silicon by integrating MPCVD diamond heat spreaders that offer 5x the thermal performance of copper, enabling smaller, more powerful automotive and industrial modules."