Material And Precision Engineering

Diamontronics Limited

🚫 No Website Found 🏢 HKSTP Source
92 Potential

Decision Maker

Dr. Jiaqi Zhu
info@diamontronics.com
+852 56249420
Unit 1035, 10/F, Building 19W, No. 19 Science Park West Avenue, Hong Kong Science Park, Pak Shek Kok, N.T.
Raw Description
Diamontronics Limited is a technology startup established in 2023. Our core team includes renowned university professors, postdoctoral researchers and PhD students in relevant fields, as well as experienced business consultants. Leveraging the innovative ecosystem of HKSTP, we focus on the R&D and commercialisation of revolutionary diamond-bonding wafer technology, aiming to provide groundbreaking thermal management solutions for high-end electronic devices such as 5G communication and artificial intelligence chips. | Description | Diamontronics Limited is dedicated to advancing the manufacturing and application of synthetic diamond wafers, with a focus on the development of diamond bonding wafers. The aim is to utilise diamond as a material for chip-level thermal management to reduce chip temperatures and enhance performance. Bonding wafers are expected to be applied in fields such as artificial intelligence, new energy vehicles, and wireless communication. || Our Beliefs | DIAMOND SEMICONDUCTOR TECHNOLOGY - SHAPE THE FUTURE | Product | Diamond-bonding wafer utilises advanced atomic-level bonding technology to achieve exceptional thermal management solutions. The product features outstanding heat dissipation performance, high bonding strength and excellent thermal stability, which can enhance high power output and ensure long-term stable operation. It is the best choice for thermal management in high-power electronic devices, leading the innovation in next-generation chip-level thermal management technology.

Strategic Analysis

Executive Brief

Diamontronics Limited is a specialized HK-based startup focusing on the heterogeneous integration of diamond with semiconductor materials. Their core competency lies in "atomic-level bonding" of diamond wafers to active device layers (GaN, SiC, Silicon) to solve the thermal throttling issues inherent in 5G, AI, and EV power electronics. They act as a critical bridge between raw diamond material and finished high-performance chips.

Strategic Fit & Lead Score

Lead Score: 92/100 (Exceptional Strategic Partner / Client)

Why this Score? Diamontronics is a "Diamond-First" company but focuses on the bonding interface rather than the growth process. They require a consistent supply of high-specification PCD and SCD wafers with specific surface morphologies to enable their atomic bonding process. Furthermore, as they scale from R&D to commercial production, they will face a "Make vs. Buy" decision regarding their diamond supply chain, making them a prime candidate for 6C’s MPCVD reactor systems.

6C Solutions Proposal

Application Area 6C Solution Technical Value Prop
Bonding Substrates High-Grade PCD Wafers Provision of large-area (>4") Polycrystalline Diamond wafers with optimized thermal conductivity (1500-2000 W/mK) tailored for high-volume AI/5G heat spreaders.
Atomic-Level Integration Ultra-Smooth SCD (Ra < 1nm) Atomic bonding requires near-perfect surface flatness. 6C’s Single Crystal Diamond with Ra < 1nm eliminates the need for aggressive post-processing, preserving material integrity.
Vertical Integration Custom MPCVD Reactor Build To reduce their COGS, Diamontronics can transition from buying wafers to growing them in-house using 6C's proprietary reactor designs and H2 generators.
Interface Engineering Direct Diamond Coating Instead of bonding a pre-grown wafer, 6C can consult on or perform direct MPCVD growth on Diamontronics' carrier substrates to eliminate the thermal boundary resistance (TBR) of the bond layer.
High-Purity Gas Supply 9N Purity H2 Generators For their internal R&D, 6C provides the ultra-high purity hydrogen generation systems required to prevent nitrogen/boron contamination during diamond processing.

Engagement Hooks

  • Technical Question: "As you scale your atomic-level bonding for AI chips, how are you managing the Thermal Boundary Resistance (TBR) at the diamond-semiconductor interface, and would a transition to direct-growth MPCVD recipes help bypass the bonding yield issues entirely?"
  • Value Statement: "6C can accelerate Diamontronics' path to market by providing the sub-nanometer roughness SCD substrates required for your bonding process, or by installing turnkey MPCVD systems to bring your diamond production in-house."

Technical Capabilities Comparison

  • Surface Quality: 6C offers SCD with Ra < 1nm, essential for the "atomic-level bonding" Diamontronics markets.
  • Scalability: 6C supports PCD wafer growth up to 5" diameters, aligning with Diamontronics' goals for 5G and AI chip-level integration.
  • Purity Control: 6C’s expertise in 9N purity hydrogen and plasma chemistry ensures the dielectric strength needed for high-frequency 5G applications.