Material And Precision Engineering

Chicony Power Technology Hong Kong Limited

🌍 Official Website 🏢 HKSTP Source
78 Potential

Decision Maker

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enquiry.marketing@hkstp.org
+852 2629 1818
5/F, Building 5E, 5 Science Park East Avenue, Hong Kong Science Park
Raw Description
Product | Chicony focuses on the design and development of power conversion products such as server switching mode power supply, workstation switching mode power supply and notebook switching adaptors. | As a high tech multinational electronics group of companies offering power products to smart building total solutions. Recently we are expanding our Smart Building Division in Hong Kong. | Activities in Science Park: | Chicony develops high performance power suppliers with intelligent and energy efficient features for use in data center applications. | The company also develop IC controllers and firmware for MCUs with the leading semiconductor manufacturers to achieve full digital control, smart energy optimization and housekeeping for power conversion applications. || Company Background Information: | A subsidiary company of Chicony Power Technology Co. Ltd., which is a division of the reputable Taiwan electronic group – Chicony Electronics. | Established in April 2002 in Hong Kong, Chicony acts as a switching mode power supply design centre and recently expanding smart building solutions for its mother company-Chicony Power Technology Co. Ltd., in WuKu, Taiwan.

Strategic Analysis

Executive Brief

Chicony Power Technology is a global leader in power conversion, specializing in high-efficiency switching mode power supplies (SMPS) for servers, workstations, and notebooks. Their current focus involves pushing the boundaries of power density and energy efficiency for data centers and "Smart Building" ecosystems, utilizing advanced IC controllers and wide-bandgap semiconductor integration.

Strategic Fit & Lead Score

Lead Score: 78/100

Why this Score? Chicony operates at the "Thermal Limit" of power electronics. As they transition to high-density AI server power supplies and GaN-based architectures, traditional copper or ceramic heat sinks become the primary bottleneck for footprint reduction. 6C’s Polycrystalline Diamond (PCD) offers a thermal conductivity >2000 W/mK (5x higher than copper), enabling the power density required for next-generation 80 PLUS Titanium+ power supplies. Their expansion into Smart Buildings also opens doors for Boron-Doped Diamond (BDD) electrochemical sensors.

6C Solutions Proposal

Application Area 6C Solution Technical Value Prop
AI Server PSUs PCD Heat Spreaders Replaces AlN or Al2O3 substrates. PCD allows for 3x higher power density in server racks by eliminating thermal throttling in high-frequency switching components.
GaN-on-Diamond Custom MPCVD Coating Direct deposition of diamond on power transistor heat-slugs. Reduces junction temperatures by up to 30°, significantly increasing the Mean Time Between Failures (MTBF) for 24/7 data center ops.
Smart Building Water Tech BDD Electrodes Integration into Smart Building water monitoring systems. BDD electrodes enable maintenance-free, reagent-free sensing of pollutants and residual chlorine with extreme longevity.
High-Voltage Isolation SCD/PCD Dielectrics Diamond’s high breakdown voltage (10 MV/cm) combined with thermal conductivity allows for ultra-thin, highly conductive insulators in high-voltage power conversion modules.
R&D Internalization Custom MPCVD Reactor Enables Chicony’s R&D team to prototype "Diamond-Enhanced" power modules in-house, securing IP on the next generation of energy-efficient converters.

Engagement Hooks

  • Technical Question: "As Chicony pushes toward 100W/in3 power density in AI server power supplies, how are you addressing the 'thermal bottleneck' of GaN components where traditional AlN substrates fail to dissipate localized heat fast enough?"
  • Value Statement: "6C can help Chicony achieve the industry's highest power-to-footprint ratio by replacing standard thermal interface materials with CVD diamond, effectively doubling your heat dissipation capacity without increasing unit size."