Electronics

TR Semiconductor (HK) Limited

🌍 Official Website 🏢 HKSTP Source
92 Potential

Decision Maker

N/A
enquiry.marketing@hkstp.org
+852 2629 1818
5/F, Building 5E, 5 Science Park East Avenue, Hong Kong Science Park
Raw Description
Our Beliefs | By establishing system-level optimisation standards through FOPLP + Top Side Cooling, we are elevating power semiconductor competition from isolated "chip-process centric" technology races to battles for ecosystem dominance. | More than a technical leap, this marks a strategic strike by new productive forces against traditional manufacturing paradigms. | Product | The only company in the industry that adopts FOPLP for the manufacturing of MOSFET power modules. This method effectively reduces package thermal resistance, increases power density, and significantly decreases PCB footprints. | Technology | Advance Power Semiconductor packaging design, system-level application optimisation. | Fan-Out Panel Level Packaging (FOPLP), power module packaging without lead frame and bond wire/copper clip. Massively reduced PCB footprints while maintaining/exceeding the thermal performance of classical power device packaging. | Follow Us || Elden Chan - Managing Director | Peter Chan - Chief Technical Officer | Description | TR SEMICONDUCTOR has invented a disruptive technology that can reform the entire ecosystem of power semiconductor devices, addressing the long-standing issue of traditional packaging – the dilemma between high power delivery and efficient heat dissipation. This technology leverages revolutionary Fan-Out Panel Level Packaging (FOPLP) and patented (PCT) Top-Side Cooling Technology.

Strategic Analysis

Executive Brief

TR Semiconductor (HK) Limited is a disruptive power semiconductor packaging firm specializing in Fan-Out Panel Level Packaging (FOPLP) and Top-Side Cooling architectures. By eliminating traditional lead frames and bond wires, they significantly reduce parasitic inductance and PCB footprint. Their core value proposition centers on resolving the "thermal bottleneck" in MOSFET power modules, positioning them as a critical player in the EV, industrial power, and high-density computing sectors.

Strategic Fit & Lead Score

Lead Score: 92/100

Why this Score? TR Semiconductor’s entire business model is built on thermal management optimization. While they currently utilize FOPLP to improve heat dissipation, the physical limit of their current materials (likely Copper or Alumina/AlN) will eventually bottle-neck their "Top-Side Cooling" efficiency. 6C's Polycrystalline Diamond (PCD) offers thermal conductivity >2000 W/mK—nearly 5x that of copper. As TR Semi moves toward higher power densities (GaN/SiC), integrating Diamond into their FOPLP workflow is the logical next step for "ecosystem dominance."

6C Solutions Proposal

Application Area 6C Solution Technical Value Prop
Top-Side Cooling PCD Heat Spreaders Replace standard AlN/Al2O3 or metal plates with PCD. Offers the world's highest thermal conductivity (1200–2000 W/mK) to eliminate localized hot spots in MOSFET modules.
FOPLP Integration Diamond-on-Substrate Coating Direct MPCVD growth of diamond thin films onto panel-level carriers or heat sinks to provide electrical insulation with extreme thermal throughput.
Next-Gen Power GaN SCD Substrates For high-frequency MOSFETs, 6C’s Single Crystal Diamond (SCD) provides the ultimate substrate for GaN-on-Diamond, reducing junction temperatures by >50°.
In-House R&D Custom MPCVD Reactor Enables TR Semiconductor to develop proprietary "Diamond-Enhanced FOPLP" recipes in-house, securing their IP moat in the "ecosystem battle."
Process Purity 9N Hydrogen Generators Ensures ultra-high purity gas supply for any plasma-based etching or deposition steps used in their advanced packaging lines.

Engagement Hooks

  • Technical Question: "Your FOPLP architecture successfully eliminates bond-wire resistance, but as you scale power density, have you hit the 'Thermal Wall' where the interface material's conductivity (k < 400 W/mK) limits your MOSFETs' junction temperature? How would a passive heat spreader with k > 1800 W/mK change your power-to-footprint ratio?"
  • Value Statement: "6C can bridge the gap between TR Semiconductor’s disruptive FOPLP design and the physical limits of thermodynamics by integrating CVD Diamond—the ultimate thermal conductor—directly into your top-side cooling stack."