Electronics

STANG Limited

🌍 Official Website 🏢 HKSTP Source
82 Potential

Decision Maker

Mr. Sidney Tang
sidney@stang.co
+852 28329699
N/A
Raw Description
Product | Our patented Thermal Thick Film Integrated Circuit (TTFIC) is a revolution in thermoelectric semiconductors. These electric powered coolers turn cold instantly and creates a cooling effect for the user relative to external | temperature. We make one of the thinnest modules in the world. | Our first device is the "future ice pack" that can be cooled without refrigerants nor chemicals. The precise temperature | control is customized for biomedical and emergency applications, not limited to cold therapy, post exercise recovery, and | heatstroke prevention. Both hot and cold functions can be applied. The device can be programmed with hot and cold cycles. || STANG Ltd develops micro cooling and heating systems. Its patented invention: Thermal Thick Film Integrated Circuit (TTFIC) solves the shortcomings of traditional bulky and complicated cooling and heating devices. | TTFIC is ultra-portable with few moving parts: simple and reliable. While in action, the heat or cold are evenly distributed | rapidly. It is high performance, highly efficient, convenient and adaptable. Solving diverse | cooling needs. | Description | QOOLMATE: The Future Ice Pack. Rapid hot & cold, portable and ready!

Strategic Analysis

Executive Brief

STANG Limited specializes in advanced thermoelectric semiconductors through their patented Thermal Thick Film Integrated Circuit (TTFIC) technology. Their primary focus is miniaturizing micro-cooling and heating systems for biomedical, portable consumer health (QOOLMATE), and emergency response applications. Their core challenge involves maximizing heat flux in ultra-thin form factors where traditional thermal management reaches physical limits.

Strategic Fit & Lead Score

Lead Score: 82 (Strong Potential)

Why this Score? STANG's TTFIC technology is a semiconductor-based cooling solution. The efficiency of thermoelectric cooling (Peltier effect) is fundamentally limited by the thermal conductivity of the substrate and the ability to dissipate heat from the "hot" side. 6C's CVD diamond offers thermal conductivity 5-10x higher than the Aluminum Nitride (AlN) or Alumina (Al2O3) substrates typically used in such modules, directly enabling the "ultra-thin" and "instant" performance STANG markets.

6C Solutions Proposal

Application Area 6C Solution Technical Value Prop
Substrate Enhancement PCD Heat Spreaders Replace standard ceramic substrates with Polycrystalline Diamond (PCD). Diamond's thermal conductivity (>1800 W/mK) reduces thermal resistance by orders of magnitude compared to Alumina (30 W/mK).
Direct Integration Diamond-on-Semiconductor Use 6C's MPCVD process to deposit diamond thin films directly onto the TTFIC wafer. This eliminates thermal interface material (TIM) layers, allowing for "instant-on" cooling.
Bio-Interface SCD/PCD Coating For biomedical applications, diamond is chemically inert and bio-compatible. A thin diamond layer provides a non-reactive, hypoallergenic interface for skin-contact cooling pads.
Device Longevity Hardened Protective Layers Diamond's extreme hardness (100 GPa) protects the delicate "Thick Film" circuits from mechanical wear and chemical corrosion in emergency/outdoor environments.
In-House R&D Custom MPCVD System Enable STANG to develop the next generation of "Diamond-Thermoelectric" hybrids in-house using a 6C-built reactor optimized for large-area growth.

Engagement Hooks

  • Technical Question: "What is the current thermal conductivity bottleneck in your TTFIC stack? If we could increase your substrate's heat spreading capability by 500% while reducing thickness, how much would that improve your Coefficient of Performance (COP) and battery life for the QOOLMATE?"
  • Value Statement: "6C can help STANG transition from 'thin' to 'ultra-efficient' by replacing traditional ceramics with CVD Diamond, the ultimate thermal conductor, ensuring your cooling modules remain the thinnest and fastest in the world."